Metallography Techniques for Soft Materials in Electronics Packaging

Written By EPRS Website Admin

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The Institute of Microengineering and Nanoelectronics (IMEN) at Universiti Kebangsaan Malaysia (UKM), in collaboration with the Electronics Packaging Research Society (EPRS), is hosting a two-day hands-on workshop titled "Metallography Techniques for Soft Materials in Electronics Packaging".

Mastering Soft Materials in Electronics Packaging

Metallography is an essential foundation for microstructural analysis, reliability studies, and failure analysis in the field of electronics packaging. However, soft materials such as tin-based solders, gold and copper wire bonds, and thin aluminum pads present unique preparation challenges. These materials easily smear, trap abrasive particles, round off at the edges, and form relief when compared to harder phases like intermetallic compounds (IMC) and silicon.

Because standard preparation methods developed for steel often damage the critical interfaces needed for observation, this workshop addresses these specific gaps by combining theoretical understanding with heavily supervised practical training.

What You Will Learn

The program is structured with a highly interactive 30% theory and 70% practice format. Participants will bypass generic materials and work directly with real electronics packaging specimens, including tin training coupons, SAC305 solder joints, and Au/Cu wire bonds.

The comprehensive curriculum will guide you through the entire workflow from sampling to high-quality micrographs:

  • Sampling and sectioning.

  • Cold mounting.

  • Grinding.

  • Polishing.

  • Etching and contrast.

  • Microscopy and imaging.

During the practical sessions, attendees will benefit from a low 1-to-4 trainer-to-participant ratio. The expert training team includes Prof. Dr. Azman Jalar, Dr. Maria Abu Bakar, Mr. Saiful Bahari Bakarudin, Mr. Nik Mohd Zaimi Nik Par, and Mr. Muhamad Nur Syahiran Mohamad Yusof.

Event Details

  • Dates: 7 – 8 October 2026 (Wednesday – Thursday).

  • Time: 8:30 AM to 5:30 PM on Day 1, and 8:30 AM to 5:00 PM on Day 2.

  • Venue: Makmal MIPAC, Blok Inovasi 2, Universiti Kebangsaan Malaysia.

  • Fee: RM 200 per participant.

  • Target Audience: Undergraduate students, postgraduate students (MSc & PhD), and early-career failure analysis (FA) engineers.

  • Capacity: Limited to strictly 20 participants.

  • Certification: Participants have the opportunity to earn both certificates of attendance and competency.

To secure your spot, scan the QR code located on the promotional poster or register directly below:

[Metallography Techniques Workshop Registration]

(Note: The promotional poster will be displayed below this text.)

EPRS Website Admin