Scientific Discourse: Metallurgy and Materials Science in Semiconductor Packaging

The Institute of Microengineering and Nanoelectronics (IMEN) at Universiti Kebangsaan Malaysia (UKM) is hosting a specialized scientific discourse focused on the critical field of semiconductor packaging. Organized by the UKM Research Group (UKMKPU-2023-022) Electronics Components Materials and Packaging, and supported by EPRS Malaysia, this program serves as a high-level engagement platform bridging local talent with international expertise.

• Date: Monday, 19 October 2026

• Time: 10:00 AM - 12:00 PM

• Venue: NanoCoE Room, Level 3, Research Complex, UKM Bangi

Program Objectives This initiative is designed as a focused mentoring program to empower and advance research capabilities within UKM. By connecting the university's community with prominent researchers, the program aims to elevate the standard of research in semiconductor packaging and materials science.

Speaker Profiles

The discourse features insights from two distinguished experts in the field:

• Professor Zhi-Quan Liu

  • Group Leader and Doctoral Supervisor, Southern University of Science and Technology (SUSTech), China

  • Professor Zhi-Quan Liu has significantly advanced the reliability of microelectronic interconnect materials by clarifying critical failure mechanisms and developing the electrodeposition of nanotwinned copper.

• Professor Dr. Azman Jalar

  • Professor of Applied Metallurgy and Principal Research Fellow in Semiconductor Packaging

  • Since 2002, Professor Azman has applied his deep expertise in materials science and metallurgy to solve complex manufacturing challenges for a wide array of local and multinational semiconductor companies.